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QN9090HN/001Z - NXP

Description: NXP - QN9090HN/001Z - MCU, 32BIT, 48MHZ, HVQFN-40

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Symbol
QN9090HN/001Z - NXP - PCB symbol
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PCB Footprints
QN9090HN/001Z - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT618-1_2021
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3D Models
QN9090HN/001Z - NXP - 3D model - Quad Flat No-Lead - SOT618-1_2021
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QN9090HN/001Z Details

  • Manufacturer Part Number:

    QN9090HN/001Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VQFN-40

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    5A992

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Additional Feature:

    Bluetooth LE 5.0

  • JESD-30 Code:

    S-PQCC-N40

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.25SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.9 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSOC

QN9090HN/001Z Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces as short as possible and use a 50-ohm impedance matching network to ensure optimal performance.
  • Ensure good thermal design and heat dissipation by using a heat sink or thermal pad, and avoid blocking airflow around the device. Operate the device within the specified temperature range of -40°C to 125°C.
  • Power up the device in the following sequence: VDD_IO, VDD_CORE, and finally VBAT. Ensure that VDD_IO and VDD_CORE are powered up simultaneously to prevent latch-up.
  • Use the device's power modes (e.g., sleep, deep sleep, and shutdown) to minimize power consumption. Implement a power management strategy that takes advantage of the device's low-power modes to reduce overall power consumption.
  • Design the antenna to operate at the desired frequency band, and ensure it is matched to the device's impedance. Place the antenna at least 10 mm away from the device to minimize detuning and ensure optimal performance.

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QN9090HN/001Z Overview

Use the download button to access the QN9090HN/001Z schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like QN909, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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