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QS3251QG - Renesas Electronics

Description: The QS3251 is a high-speed CMOS TTL-compatible 8:1 multiplexer/ demultiplexer. The QS3251 has 3-state outputs. The QS3251 is a function and pinout compatible version of the 74F251, 74FCT251 and the 74ALS/ AS/LS251 8:1 multiplexers. The low ON resistance of the QS3251 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. Mux/Demux devices provide an order of magnitude faster speed than equivalent logic devices. The QS3251 is character

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QS3251QG - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - DCG16-ren1
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QS3251QG Details

  • Manufacturer Part Number:

    QS3251QG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QSOP

  • Package Description:

    QSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    PCG16

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    CBT/FST/QS/5C/B

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    4.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Ports:

    9

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    1.5 mA

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

QS3251QG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note AN9854, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • Renesas provides a range of application notes and design guides that provide configuration examples and guidelines for specific applications. Additionally, the QS3251QG evaluation board and development kits can be used to test and validate designs before moving to production.
  • The QS3251QG has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to follow proper thermal management practices, such as using a heat sink, thermal interface material, and ensuring good airflow. Renesas provides thermal management guidelines in their application notes and datasheet.
  • Renesas provides a range of troubleshooting resources, including application notes, FAQs, and technical support. Engineers can also use the QS3251QG evaluation board and development kits to debug and test their designs. Additionally, Renesas recommends following a systematic troubleshooting approach, starting with the power supply and clock signals, and then moving to the device's configuration and programming.
  • The QS3251QG is designed to meet the radiation hardness and EMC requirements for automotive and industrial applications. Renesas provides detailed information on radiation hardness and EMC testing in their datasheet and application notes. Engineers should also follow industry standards and guidelines for radiation hardness and EMC design.

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QS3251QG Overview

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