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QS3VH16211PAG8 - Renesas Electronics

Description: The QS3VH16211 HotSwitch is a 24-bit high bandwidth bus switch. The QS3VH16211 has very low ON resistance, resulting in under 250ps propagation delay through the switch. The combination of near-zero propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH16211 ideal for high performance communications applications. It is also suitable for switching wide digital buses. The QS3VH16211 operates from -40C to +85C.

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QS3VH16211PAG8 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PAG56-ren1
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QS3VH16211PAG8 - Renesas Electronics  - 3D model - Small Outline Packages - PAG56-ren1
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QS3VH16211PAG8 Details

  • Manufacturer Part Number:

    QS3VH16211PAG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    56

  • Manufacturer Package Code:

    PAG56

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Family:

    CB3Q/3VH/3C/2B

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Logic IC Type:

    BUS DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    2

  • Number of Ports:

    2

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    0.2 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

QS3VH16211PAG8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. It's essential to follow these guidelines to ensure optimal performance, minimize signal integrity issues, and reduce electromagnetic interference (EMI).
  • The QS3VH16211PAG8 has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat efficiently. Additionally, ensure good airflow around the device, and consider using thermal interface materials (TIMs) or heat sinks if necessary.
  • The datasheet provides general guidelines for input/output termination resistors, but the specific values may vary depending on the system design and signal frequencies. Renesas recommends consulting their application notes and simulation tools to determine the optimal termination resistor values for your specific application.
  • To ensure signal integrity and minimize jitter, follow best practices for PCB design, such as using differential signaling, minimizing trace lengths, and avoiding vias and stubs. Additionally, use simulation tools to analyze signal integrity and optimize your design accordingly.
  • The QS3VH16211PAG8 has specific power sequencing requirements to ensure proper operation and prevent damage. Consult the datasheet and application notes for detailed information on power-up and power-down sequencing, as well as voltage ramp rates and timing.

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QS3VH16211PAG8 Overview

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Part Image QS3VH16211PAG Integrated Device Technology Inc

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Part Image 74CB3Q16211DGGRE4 Texas Instruments

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Part Image QS3VH16211PA Integrated Device Technology Inc

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