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QS3VH16800PAG - Renesas Electronics

Description: The QS3VH16800 HotSwitch is a 20-bit high bandwidth bus switch with very low ON resistance, resulting in under 250ps propagation delay through the switch. The switches can be turned ON under the control of the LVTTL-compatible Output Enable signal for bidirectional data flow with no added delay or ground bounce. It can be used as two 10-bit bus switches or one 20-bit bus switch. The combination of near-zero propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH16800 ideal for high

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QS3VH16800PAG - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PAG48
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QS3VH16800PAG - Renesas Electronics  - 3D model - Small Outline Packages - PAG48
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QS3VH16800PAG Details

  • Manufacturer Part Number:

    QS3VH16800PAG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    PAG48

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    CB3Q/3VH/3C/2B

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    12.5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    10

  • Number of Functions:

    2

  • Number of Ports:

    2

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    3 mA

  • Prop. Delay@Nom-Sup:

    0.2 ns

  • Propagation Delay (tpd):

    0.2 ns

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    6.1 mm

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QS3VH16800PAG Overview

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