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QS3VH257QG8 - Renesas Electronics

Description: The QS3VH257 HotSwitch Quad 2:1 multiplexer/demultiplexer is a high bandwidth bus switch with very low ON resistance, resulting in under 250ps propagation delay through the switch. The combination of near-zero propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH257 ideal for high performance communication applications. The QS3VH257 operates from -40C to +85C.

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QS3VH257QG8 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PCG16-ren1
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QS3VH257QG8 - Renesas Electronics  - 3D model - Small Outline Packages - PCG16-ren1
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QS3VH257QG8 Details

  • Manufacturer Part Number:

    QS3VH257QG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QSOP

  • Pin Count:

    16

  • Manufacturer Package Code:

    PCG16

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    CB3Q/3VH/3C/2B

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    4

  • Number of Ports:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    0.2 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.73 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

QS3VH257QG8 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a decoupling capacitor (e.g., 0.1uF) close to the VCC pin.
  • Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the device. Avoid overheating by keeping the junction temperature (TJ) below 150°C.
  • Use a series resistor (e.g., 22Ω) and a parallel capacitor (e.g., 100pF) for input termination. For output termination, use a series resistor (e.g., 33Ω) and a parallel capacitor (e.g., 100pF) to match the transmission line impedance.
  • Power up the device in the following sequence: VCC, then VCCA, then input signals. Power down in the reverse sequence. Ensure a minimum of 10ms delay between power-up and input signal application.
  • Keep signal rise and fall times below 1ns. Ensure a maximum jitter of 100ps for clock signals. Use a jitter attenuator or a clock conditioner if necessary.

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QS3VH257QG8 Overview

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