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QSB363 - onsemi

Description: Tape & Reel option (See tape & Reel specifications); Medium wide beam angle 24°; Lead form options: Gullwing, Yoke, Z-Bend; Matched emitters: QEB363 or QEB373; T-3/4 (2 mm) surface mount package; Daylight filter; Black plastic package; NPN silicon phototransistor

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PCB Footprints
QSB363 - onsemi PCB footprint - Other - Other - QSB363-3
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3D Models
QSB363 - onsemi  - 3D model - Other - QSB363-3
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QSB363 Details

  • Manufacturer Part Number:

    QSB363

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    T-3/4 2.50x2.00

  • Package Description:

    PLASTIC PACKAGE-2

  • Manufacturer Package Code:

    100CB

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8541.40.70.80

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.14

  • Additional Feature:

    DAY LIGHT FILTER

  • Coll-Emtr Bkdn Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Dark Current-Max:

    100 nA

  • Infrared Range:

    YES

  • JESD-609 Code:

    e3

  • Light Current-Nom:

    1.5 mA

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Optoelectronic Device Type:

    PHOTO TRANSISTOR

  • Packing Method:

    BAG

  • Peak Wavelength:

    940 nm

  • Power Dissipation-Max:

    0.1 W

  • Response Time-Max:

    0.000015 s

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

QSB363 Frequently Asked Questions (FAQs)

  • A good PCB layout for the QSB363 should ensure that the input and output pins are separated as much as possible to minimize electromagnetic interference (EMI). Additionally, the PCB should have a solid ground plane and a low-impedance path for the output current. It's also recommended to use a Kelvin connection for the output sense pins to improve accuracy.
  • The QSB363 has a maximum junction temperature of 150°C. To ensure proper thermal management, it's recommended to attach a heat sink to the device, especially in high-power applications. The heat sink should be designed to keep the junction temperature below 125°C to ensure reliable operation. Additionally, the PCB should be designed to minimize thermal resistance and ensure good airflow around the device.
  • The recommended input capacitor value for the QSB363 is 10uF to 22uF, with a voltage rating of at least 25V. A low-ESR ceramic capacitor or a film capacitor is recommended due to their low equivalent series resistance (ESR) and high reliability. The input capacitor should be placed as close as possible to the input pins of the device to minimize noise and ensure stable operation.
  • To troubleshoot issues with the QSB363, start by checking the input voltage and current to ensure they are within the recommended specifications. Verify that the output voltage is within the expected range and that the output current is not exceeding the maximum rating. Check the PCB layout for any signs of overheating, such as burned components or discoloration. Use an oscilloscope to check for any noise or oscillations on the output voltage. If the issue persists, consult the onsemi application note AN10484 for troubleshooting guidelines.
  • Yes, the QSB363 is qualified for use in high-reliability and automotive applications. It meets the requirements of the AEC-Q100 standard for automotive-grade devices and is designed to operate in harsh environments. However, it's essential to follow the recommended design guidelines and testing procedures to ensure the device meets the specific requirements of the application.

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QSB363 Overview

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