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QSE113E3R0 - onsemi

Description: Medium wide reception angle, 50< °; Package material and color: black epoxy; NPN silicon phototransistor; Daylight filter; High sensitivity; Package type: sidelooker; Matched emitter: QEE113

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QSE113E3R0 - onsemi PCB footprint - Other - Other - QSE113E3R0-3
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QSE113E3R0 - onsemi  - 3D model - Other - QSE113E3R0-3
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QSE113E3R0 Details

  • Manufacturer Part Number:

    QSE113E3R0

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SIDELOOKER 4.44x5.08x2.54, 2.54P

  • Package Description:

    LEAD FREE, PLASTIC PACKAGE-2

  • Manufacturer Package Code:

    100CJ

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.70.80

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.29

  • Additional Feature:

    HIGH SENSITIVITY, DAY LIGHT FILTER, SIDE LOOKER

  • Coll-Emtr Bkdn Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Dark Current-Max:

    100 nA

  • Infrared Range:

    YES

  • JESD-609 Code:

    e3

  • Light Current-Nom:

    0.25 mA

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Functions:

    1

  • On-State Current-Max:

    0.0015 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    PHOTO TRANSISTOR

  • Packing Method:

    TR

  • Peak Wavelength:

    880 nm

  • Power Dissipation-Max:

    0.1 W

  • Response Time-Max:

    0.000008 s

  • Shape:

    ROUND

  • Size:

    1.65 mm

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

QSE113E3R0 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended to ensure good heat dissipation.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Avoid exceeding the maximum junction temperature (Tj) of 150°C.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended. Avoid exceeding 280°C to prevent damage to the device.
  • Handle the device with ESD-protective equipment and follow proper ESD handling procedures. Use an ESD-protective wrist strap or mat, and ensure that the device is stored in an ESD-protective package.
  • Store the device in a dry, cool place away from direct sunlight. Avoid exposing the device to moisture, extreme temperatures, or physical stress.

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QSE113E3R0 Overview

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