R-723.3D - RECOM Power

R-723.3D Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
• Can I use the R-723.3D in a high-vibration environment?
  Yes, the R-723.3D is designed to withstand vibrations up to 10G peak acceleration, making it suitable for use in high-vibration environments. However, it's essential to ensure proper mounting and screw torque to prevent damage or disconnection.
• How do I ensure the module's reliability in high-temperature applications?
  To ensure reliability in high-temperature applications, RECOM recommends derating the output power according to the temperature derating curve provided in the datasheet. Additionally, ensure good airflow around the module, and consider using a heat sink or thermal interface material to reduce the thermal resistance.
• What is the recommended input capacitor type and value for the R-723.3D?
  RECOM recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, rated for the input voltage, to filter the input voltage and reduce noise. The capacitor should be placed as close as possible to the module's input pins.
• Can I parallel multiple R-723.3D modules to increase the output power?
  Yes, multiple R-723.3D modules can be paralleled to increase the output power. However, it's essential to ensure that the modules are identical, and the output voltages are matched within 1% to prevent current imbalance. Additionally, a common input capacitor and a shared output capacitor are recommended to reduce noise and ensure stable operation.