R0.25D-0505 - RECOM Power

R0.25D-0505 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout and thermal management for optimal performance?
  RECOM recommends a PCB layout with a large copper area for heat dissipation, and a thermal via connection to the heat sink. A minimum of 1 oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK should be used between the module and the heat sink.
• How do I ensure the module is properly soldered and connected?
  RECOM recommends using a soldering iron with a temperature of 350°C (662°F) and a solder with a melting point of 220°C (428°F). The module should be soldered within 3 seconds, and the solder joints should be inspected for any signs of cold soldering or overheating.
• What is the derating curve for the module's output power versus ambient temperature?
  The derating curve for the R0.25D-0505 is typically provided in the datasheet, but if not, RECOM can provide it upon request. As a general guideline, the output power should be derated by 1.5% per degree Celsius above 40°C (104°F) ambient temperature.
• Can I use this module in a high-vibration or high-shock environment?
  The R0.25D-0505 is designed to meet the requirements of IEC 60068-2-6 (vibration) and IEC 60068-2-27 (shock). However, it's recommended to consult with RECOM's application engineers to ensure the module meets the specific requirements of your application.
• What is the recommended input capacitor value and type for this module?
  RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF, rated for at least 50 V, and placed as close as possible to the input pins of the module.