RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
To ensure reliability in high-temperature environments, RECOM recommends following the derating curves provided in the datasheet. Additionally, the module should be mounted on a heat sink or a metal plate to dissipate heat, and the ambient temperature should be kept below the maximum rated temperature of 85°C.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF, X7R or X5R dielectric, and a voltage rating of 50-100 V. The capacitor should be placed as close as possible to the module's input pins to minimize noise and ripple.
Yes, the R05P05S/P can be used in a redundant or parallel configuration to achieve higher power ratings or to improve system reliability. However, RECOM recommends consulting with their application engineers to ensure proper design and implementation of the redundant or parallel configuration.
The R05P05S/P module will shut down during an input voltage brownout or dropout, and will automatically restart when the input voltage returns to a valid range. The module's undervoltage lockout (UVLO) feature ensures that the module does not operate during low input voltage conditions.
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