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R1RW0416DSB-2PI#D0 - Renesas Electronics

Description: The R1RW0416DI is a 4-Mbit High-Speed static RAM organized 256-kword × 16-bit. It has realized High-Speed access time by employing CMOS process (6-transistor memory cell) and High-Speed circuit designing technology. It is most appropriate for the application which requires High-Speed, high density memory and wide bit width configuration, such as cache and buffer memory in system. The R1RW0416DI is packaged in 400-mil 44-pin SOJ and 400-mil 44-pin plastic TSOPII for high density surface mounting.

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R1RW0416DSB-2PI#D0 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - P-TSOP(2) 44-10.16×18.41-0.80
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R1RW0416DSB-2PI#D0 - Renesas Electronics  - 3D model - Small Outline Packages - P-TSOP(2) 44-10.16×18.41-0.80
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R1RW0416DSB-2PI#D0 Details

  • Manufacturer Part Number:

    R1RW0416DSB-2PI#D0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP(44)

  • Package Description:

    TSOP2-44

  • Pin Count:

    44

  • Manufacturer Package Code:

    PTSB0044GA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    12 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PDSO-G44

  • Length:

    18.41 mm

  • Memory Density:

    4194304 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP2

  • Package Equivalence Code:

    TSOP44,.46,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    TRAY

  • Parallel/Serial:

    PARALLEL

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.005 A

  • Standby Voltage-Min:

    3 V

  • Supply Current-Max:

    0.13 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Width:

    10.16 mm

R1RW0416DSB-2PI#D0 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for airflow and heat dissipation.
  • Power up the device in the following sequence: VCC, AVCC, and then VREF. Ensure a minimum delay of 10ms between each power-up step to prevent latch-up or damage.
  • Use a multi-layer PCB with a solid ground plane, and consider adding a 10nF capacitor between VCC and GND for noise filtering. Also, ensure that high-frequency signals are routed away from sensitive analog circuits.
  • Use a dedicated reset IC or a simple RC circuit with a 10kΩ resistor and a 10μF capacitor to ensure a clean reset signal. Ensure the reset signal is asserted for at least 10ms to guarantee a proper reset.
  • Ensure a thermal interface material (TIM) is used between the device and the heat sink. A heat sink with a thermal resistance of 10°C/W or lower is recommended. Also, consider using a thermal pad or a heat spreader for improved heat dissipation.

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R1RW0416DSB-2PI#D0 Overview

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