RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
Yes, the R1S-3.324/HP is designed to withstand high vibrations. It meets the IEC 60068-2-6 vibration test standard, which involves sinusoidal vibration at 10-2000 Hz, 2G amplitude, and 3 axes. However, it's recommended to consult with RECOM's application engineers to ensure the module meets your specific vibration requirements.
To ensure reliability in high-temperature environments, RECOM recommends following the derating curves provided in the datasheet. Additionally, ensure good airflow around the module, and consider using a heat sink or thermal interface material to reduce the thermal resistance between the module and the PCB.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF, X7R or X5R dielectric, and a voltage rating of at least 50V. The capacitor should be placed as close as possible to the module's input pins to minimize noise and ensure stable operation.
Yes, the R1S-3.324/HP can be used in a redundant or parallel configuration to achieve higher power or redundancy. However, it's essential to consult with RECOM's application engineers to ensure the modules are properly synchronized and configured to meet your specific requirements.
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R1S-3.324/HP Overview
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