RECOM Power Inc recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
To ensure reliability in high-temperature environments, it is essential to follow the recommended derating curves for the module's output power and input voltage. Additionally, ensure good airflow around the module, and consider using a heat sink or a metal plate to dissipate heat. It is also recommended to follow the recommended storage and operating temperature ranges specified in the datasheet.
RECOM Power Inc recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, rated for the input voltage range of the module. The capacitor should be placed as close as possible to the module's input pins to minimize noise and ensure stable operation.
Yes, the R24P215S/P/X2 can be used in a redundant or parallel configuration to achieve higher power output or redundancy. However, it is essential to follow the recommended guidelines for paralleling or redundancy, including using identical modules, ensuring proper synchronization, and providing adequate heat dissipation.
The typical MTBF for the R24P215S/P/X2 is >1 million hours, calculated according to MIL-HDBK-217F. However, the actual MTBF may vary depending on the operating conditions, environment, and other factors.
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R24P215S/P/X2 Overview
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