RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
To ensure reliability in high-temperature environments, it's essential to follow the recommended derating curves for output power and input voltage. Additionally, ensure good airflow around the module, and consider using a heat sink or thermal interface material to reduce the thermal resistance between the module and the heat sink.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF, X7R or X5R dielectric, and a voltage rating of 50-100 V. The capacitor should be placed as close as possible to the input pins of the module.
Yes, the R24P215S/P can be used in a redundant or parallel configuration. However, it's essential to ensure that the modules are synchronized and share the load equally to prevent overcurrent or overheating. RECOM recommends consulting their application notes or contacting their technical support for more information on parallel and redundant configurations.
The R24P215S/P has a built-in undervoltage lockout (UVLO) feature that shuts down the module when the input voltage falls below 12 V. The module will automatically restart when the input voltage recovers to a level above 12 V.
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R24P215S/P Overview
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