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R5009ANX - ROHM Semiconductor

Description: ROHM R5009ANX N-channel MOSFET Transistor, 9 A, 500 V, 3-Pin TO-220FM

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R5009ANX - ROHM Semiconductor - PCB symbol
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PCB Footprints
R5009ANX - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220FM_2021
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R5009ANX - ROHM Semiconductor - 3D model - Transistor Outline, Vertical - TO-220FM_2021
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R5009ANX Details

  • Manufacturer Part Number:

    R5009ANX

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220FM, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    5.4 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    9 A

  • Drain-source On Resistance-Max:

    0.72 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    50 W

  • Pulsed Drain Current-Max (IDM):

    36 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

R5009ANX Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
  • To ensure stable operation with a high-ESR output capacitor, ROHM recommends adding a 1nF to 10nF ceramic capacitor in parallel with the output capacitor to reduce the overall ESR. Additionally, the output capacitor should be placed close to the IC to minimize parasitic inductance.
  • The maximum allowed voltage on the EN pin is 6V, which is higher than the recommended operating voltage of 5V. However, it's essential to ensure that the EN pin voltage does not exceed the IC's supply voltage (VIN) to prevent damage.
  • The R5009ANX is rated for operation up to 105°C, but ROHM recommends derating the output current and power dissipation to ensure reliable operation. A thermal design and simulation should be performed to ensure the IC operates within its thermal limits.
  • The output voltage ripple and noise can be calculated using the equations provided in the datasheet. Additionally, ROHM recommends using a low-ESR output capacitor and a high-frequency ceramic capacitor in parallel to reduce the output voltage ripple and noise.

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R5009ANX Overview

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