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R5F101AFASP#50 - Renesas Electronics

Description: Ultra-low power consumption technology  VDD = single power supply voltage of 1.6 to 5.5 V  HALT mode  STOP mode  SNOOZE mode RL78 CPU core  CISC architecture with 3-stage pipeline  Minimum instruction execution time: Can be changed from high speed (0.03125 μs: @ 32 MHz operation with high-speed on-chip oscillator) to ultra-low speed (30.5 μs: @ 32.768 kHz operation with subsystem clock)  Address space: 1 MB  General-purpose registers: (8-bit register × 8) × 4 banks  On-chip RAM: 2 to

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R5F101AFASP#50 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PLSP0030JB-B
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R5F101AFASP#50 Details

  • Manufacturer Part Number:

    R5F101AFASP#50

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LSSOP

  • Package Description:

    LSSOP-30

  • Pin Count:

    30

  • Manufacturer Package Code:

    PLSP0030JB

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    9

  • Has ADC:

    YES

  • Additional Feature:

    IT ALSO OPERATES AT 4MHZ @1.6V MIN SUPPLY

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • CPU Family:

    RL78

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDSO-G30

  • Length:

    9.85 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    2

  • Number of External Interrupts:

    6

  • Number of I/O Lines:

    26

  • Number of Serial I/Os:

    3

  • Number of Terminals:

    30

  • Number of Timers:

    9

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SSOP30,.32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • RAM (bytes):

    8192

  • ROM (words):

    98304

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.4 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    8.5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    6.1 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

Trust Checks

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Manufacturer Collaborated
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Sponsored

R5F101AFASP#50 Overview

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