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R5F10RB8AFP#10 - Renesas Electronics

Description: RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s

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R5F10RB8AFP#10 - Renesas Electronics - PCB symbol
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R5F10RB8AFP#10 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PLQP0032GB-A
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R5F10RB8AFP#10 - Renesas Electronics - 3D model - Quad Flat Packages - PLQP0032GB-A
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R5F10RB8AFP#10 Details

  • Manufacturer Part Number:

    R5F10RB8AFP#10

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    PLQP0032GB

  • HTS Code:

    8542.31.00.20

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    10

  • Has ADC:

    YES

  • Additional Feature:

    OPERATES AT 1.6 MINIMUM SUPPLY AT 4 MHZ

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • CPU Family:

    RL78

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G32

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    2

  • Number of External Interrupts:

    3

  • Number of I/O Lines:

    20

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    32

  • Number of Timers:

    9

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP32,.35SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • RAM (bytes):

    1024

  • ROM (words):

    8192

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    24 MHz

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F10RB8AFP#10 Frequently Asked Questions (FAQs)

  • Renesas provides a reference PCB layout guide in the R5F10RB8AFP#10 application note (Document ID: R01AN4301EU0100). It recommends a 4-layer PCB with a dedicated power plane, decoupling capacitors, and thermal vias to ensure optimal performance and thermal management.
  • Renesas provides a Secure Firmware Update (SFU) solution that uses a combination of hardware and software security features. Engineers can use the Renesas Flash Development Toolkit (FDT) and the SFU library to implement secure boot and firmware updates. Refer to the R5F10RB8AFP#10 Secure Firmware Update Application Note (Document ID: R01AN4302EU0100) for more information.
  • The R5F10RB8AFP#10 datasheet provides general power consumption information, but for more detailed information, engineers can refer to the R5F10RB8AFP#10 Power Consumption Application Note (Document ID: R01AN4303EU0100). This document provides power consumption characteristics in different operating modes, including sleep modes, and offers guidance on power optimization techniques.
  • Renesas provides a CAN Interface Application Note (Document ID: R01AN4304EU0100) that explains how to use the R5F10RB8AFP#10's built-in CAN interface. The document covers CAN protocol basics, configuration, and programming examples using the Renesas Compiler Package (RCP) and the CAN API library.
  • Renesas provides a Thermal Management Application Note (Document ID: R01AN4305EU0100) that offers guidance on thermal management considerations for the R5F10RB8AFP#10 in high-temperature environments. The document covers thermal design guidelines, heat sink selection, and thermal interface material recommendations.

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