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R5F11CCCMBG#W0 - Renesas Electronics

Description: The RL78/I1E microcontroller is an intelligent, flexible analog MCU suitable for countless industrial and medical sensing applications such as flow measurement, strain gauges, pressure or temperature sensing. With enhanced analog features such as configurable op-amps with programmable gain, supporting inverting, non-inverting topologies, or instrumentation amplifiers, the RL78/I1E can be a platform for different types of sensors. The RL78/I1E features a 24-bit delta-sigma A/D, and a separate 10-bit A/D bloc

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R5F11CCCMBG#W0 - Renesas Electronics PCB footprint - BGA - BGA - 36-pin plastic TFBGA
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R5F11CCCMBG#W0 - Renesas Electronics  - 3D model - BGA - 36-pin plastic TFBGA
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R5F11CCCMBG#W0 Details

  • Manufacturer Part Number:

    R5F11CCCMBG#W0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TFBGA

  • Pin Count:

    36

  • Manufacturer Package Code:

    PTBG0036KA

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.20

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Has ADC:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • CPU Family:

    RL78

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PBGA-B36

  • Length:

    4 mm

  • Low Power Mode:

    YES

  • Number of External Interrupts:

    8

  • Number of I/O Lines:

    14

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    36

  • Number of Timers:

    9

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA36,6X6,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RAM (bytes):

    8192

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.1 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    9.3 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

R5F11CCCMBG#W0 Overview

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