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R5F21275SDFP#X6 - Renesas Electronics

Description: The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data

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R5F21275SDFP#X6 - Renesas Electronics - PCB symbol
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R5F21275SDFP#X6 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PLQP0032GB-A
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R5F21275SDFP#X6 - Renesas Electronics - 3D model - Quad Flat Packages - PLQP0032GB-A
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R5F21275SDFP#X6 Details

  • Manufacturer Part Number:

    R5F21275SDFP#X6

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    LQFP

  • Package Description:

    7 X 7 MM, 0.80 MM PITCH, PLASTIC, LQFP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    PLQP0032GB

  • HTS Code:

    8542.31.00.20

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    3

  • Has ADC:

    YES

  • Additional Feature:

    IT ALSO OPERATES IN 2.2V AT 5MHZ

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    S-PQFP-G32

  • Length:

    7 mm

  • Number of I/O Lines:

    28

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    20 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F21275SDFP#X6 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply VCC first, followed by VDD, and then the clock signal. This ensures that the internal voltage regulators and clock circuitry are properly initialized.
  • The clock settings can be configured through the Clock Control Register (CCR) and the PLL Control Register (PCR). The CCR sets the clock source and frequency, while the PCR configures the PLL settings. Refer to the user manual for detailed instructions.
  • The maximum operating temperature range for the R5F21275SDFP is -40°C to 125°C. However, it's recommended to operate the device within the industrial temperature range of -40°C to 85°C for optimal performance and reliability.
  • The R5F21275SDFP has a built-in watchdog timer that can be enabled and configured through the Watchdog Timer Control Register (WTCR). The watchdog timer can be set to reset the device or generate an interrupt if the timer expires.
  • The maximum current consumption of the R5F21275SDFP depends on the operating frequency and voltage. According to the datasheet, the maximum current consumption is approximately 350 mA at 100 MHz and 3.3 V. However, this value can vary depending on the specific application and usage.

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R5F21275SDFP#X6 Overview

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