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R5F213J6CNNP
Renesas Electronics
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1 | Renesas Technology R5F213J6CNNP, 16/32bit R8C Microcontroller, 20MHz, 32 kB ROM, 36-Pin HWQFN | Quad Flat No-Lead | R5F213J6CNNP |
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R5F21358CDFP
Renesas Electronics
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1 | Renesas Technology R5F21358CDFP, 16/32bit R8C Microcontroller, 20MHz, 64 kB ROM, 52-Pin LQFP | Quad Flat Packages | R5F21358CDFP |
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R5F21237JFP
Renesas Electronics
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1 | MCU 16-bit R8C CISC 48KB Flash 3.3V/5V Automotive 48-Pin LQFP | Quad Flat Packages | R5F21237JFP |
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R5F21346CDFP
Renesas Electronics
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1 | Renesas Technology R5F21346CDFP, 16/32bit R8C Microcontroller, 20MHz, 32 kB ROM, 48-Pin LQFP | Quad Flat Packages | R5F21346CDFP |
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R5F211A3DSP
Renesas Electronics
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1 | D | Small Outline Packages | R5F211A3DSP |
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R5F21274KFP#W4
Renesas Electronics
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1 | The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data | Quad Flat Packages | R5F21274KFP#W4 |
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R5F2136CCNFP#V0
Renesas Electronics
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1 | The R8C/36C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/36C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating | Quad Flat Packages | R5F2136CCNFP#V0 |
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R5F21272SDFP#V2
Renesas Electronics
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1 | The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data | Quad Flat Packages | R5F21272SDFP#V2 |
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R5F21183SP#U0
Renesas Electronics
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1 | The R8C/18 Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 20-pin plastic molded LSSOP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. Furthermore, the data flash ROM ( | Small Outline Packages | R5F21183SP#U0 |
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R5F213G4CDSP#U0
Renesas Electronics
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1 | The R8C/3GC Group is supported only for customers who have already adopted these products. The RL78/G1F, RL78/G13 Groups are recommended for new designs.The R8C/3GC Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating | Small Outline Packages | R5F213G4CDSP#U0 |
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R5F212BCSDFP#V2
Renesas Electronics
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1 | The R8C/2B Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/2A Group and R8C/2B Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp | Quad Flat Packages | R5F212BCSDFP#V2 |
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R5F211B4DSP#U0
Renesas Electronics
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1 | The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high | Small Outline Packages | R5F211B4DSP#U0 |
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R5F212A8SNFA#V2
Renesas Electronics
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1 | The R8C/2A Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat | Quad Flat Packages | R5F212A8SNFA#V2 |
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R5F21236DFP#U0
Renesas Electronics
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1 | The R8C/23 Group is supported only for customers who have already adopted these products.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and suited to in-vehicle or FA networking. Furthermore, | Quad Flat Packages | R5F21236DFP#U0 |
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R5F21274SDFP#V2
Renesas Electronics
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1 | The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data | Quad Flat Packages | R5F21274SDFP#V2 |
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R5F21336CDFP#30
Renesas Electronics
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1 | The R8C/33C Group is supported only for customers who have already adopted these products.The R8C/33C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed | Quad Flat Packages | R5F21336CDFP#30 |
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R5F2122CJFP#U0
Renesas Electronics
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1 | The R8C/22 Group is supported only for customers who have already adopted these products. The RL78/F12, F13, F14, F15 Groups are recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This Furthermore, the data fl | Quad Flat Packages | R5F2122CJFP#U0 |
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R5F21254SNFP#V2
Renesas Electronics
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1 | The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu | Quad Flat Packages | R5F21254SNFP#V2 |
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R5F21272SNFP#X6
Renesas Electronics
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1 | The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data | Quad Flat Packages | R5F21272SNFP#X6 |
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R5F211B1SP#U0
Renesas Electronics
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1 | The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high | Small Outline Packages | R5F211B1SP#U0 |
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R5F21336DNFP#V2
Renesas Electronics
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1 | The R8C/33D Group is supported only for customers who have already adopted these products.The R8C/33D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed | Quad Flat Packages | R5F21336DNFP#V2 |
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R5F21355CNFP#V2
Renesas Electronics
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1 | The R8C/35C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/35C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating | Quad Flat Packages | R5F21355CNFP#V2 |
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R5F21324CNSP#W4
Renesas Electronics
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1 | The R8C/32C Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324CNSP#W4 |
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R5F21336MNFP#50
Renesas Electronics
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1 | The R8C/33M Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designsThe R8C/33M Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Quad Flat Packages | R5F21336MNFP#50 |
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R5F21275SNFP#V2
Renesas Electronics
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1 | The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data | Quad Flat Packages | R5F21275SNFP#V2 |
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