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R5F21322DNSP#W4 - Renesas Electronics

Description: The R8C/32D Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow

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R5F21322DNSP#W4 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PLSP0020JB-A
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R5F21322DNSP#W4 Details

  • Manufacturer Part Number:

    R5F21322DNSP#W4

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LSSOP

  • Package Description:

    4.40 X 6.50 MM, 0.65 MM PITCH, PLASTIC, LSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    PLSP0020JB

  • HTS Code:

    8542.31.00.20

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    IT ALSO OPERATES IN 1.8V AT 5MHZ

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • CPU Family:

    R8C

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e2

  • Length:

    6.5 mm

  • Number of I/O Lines:

    16

  • Number of Terminals:

    20

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    1024

  • ROM (words):

    8192

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.45 mm

  • Speed:

    20 MHz

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    TIN COPPER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F21322DNSP#W4 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply VCC first, followed by VCCIO, and then the clock signal. This ensures proper initialization of the internal voltage regulators and prevents latch-up.
  • The clock settings can be configured through the Clock Control Register (CCR). The CCR allows you to select the clock source, divide the clock frequency, and enable or disable the clock output. Refer to the user manual for detailed instructions.
  • The maximum operating temperature range for the R5F21322DNSP#W4 is -40°C to 125°C. However, it's recommended to operate the device within the industrial temperature range of -40°C to 85°C for optimal performance and reliability.
  • The R5F21322DNSP#W4 has a built-in watchdog timer that can be enabled and configured through the Watchdog Timer Control Register (WTCR). The watchdog timer can be used to reset the device in case of a software fault or hang-up.
  • The VCCIO pin is used to power the I/O circuits of the device. It should be connected to a power supply that is separate from the VCC pin, which powers the core logic. This allows for better noise isolation and improved overall performance.

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