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R5F213G6DNSP#W4 - Renesas Electronics

Description: The R8C/3GD Group is supported only for customers who have already adopted these products. The RL78/G1F, RL78/G13 Groups are recommended for new designs.The R8C/3GD Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating

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R5F213G6DNSP#W4 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - P-LSSOP24-5.6x7.8-0.65-+
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R5F213G6DNSP#W4 - Renesas Electronics  - 3D model - Small Outline Packages - P-LSSOP24-5.6x7.8-0.65-+
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R5F213G6DNSP#W4 Details

  • Manufacturer Part Number:

    R5F213G6DNSP#W4

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LSSOP

  • Package Description:

    5.60 X 7.80 MM, 0.65 MM PITCH, PLASTIC, LSSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    PLSP0024JB

  • HTS Code:

    8542.31.00.20

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    IT ALSO OPERATES IN 1.8V AT 5MHZ

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • CPU Family:

    R8C

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    R-PDSO-G24

  • Length:

    7.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    20

  • Number of Terminals:

    24

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SSOP24,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    1024

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.45 mm

  • Speed:

    20 MHz

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    5.6 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F213G6DNSP#W4 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply VCC first, followed by VCCPLL, and then the clock signal. This ensures proper initialization of the internal PLL and clock circuits.
  • The clock settings can be configured using the Clock Control Register (CKCR) and the PLL Control Register (PLLCR). Refer to the user manual for detailed instructions and register descriptions.
  • The maximum operating frequency of the R5F213G6DNSP#W4 is 32 MHz, but it can be overclocked to 40 MHz with reduced voltage and temperature ranges.
  • The ADC can be used by configuring the ADC Control Register (ADCCR) and the ADC Channel Select Register (ADCSR). Refer to the user manual for detailed instructions and register descriptions.
  • The VCCPLL pin is used to power the internal PLL circuit, which generates the clock signal for the microcontroller. It should be connected to a stable power source, such as a voltage regulator or a battery.

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