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R5F51115AGFL#3A - Renesas Electronics

Description: The RX111 Group has a comprehensive small-capacity ROM/low pin count lineup. With USB 2.0 for Battery Charging (BC 1.2), low consumption current, and fast wakeup from standby, these microcontrollers are suitable for use in computer peripherals, and healthcare and wearable devices. With their three-phase motor control timers, they are also suitable for motor control applications in home appliances and industrial equipment.

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R5F51115AGFL#3A - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PLQP0048KB
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R5F51115AGFL#3A - Renesas Electronics  - 3D model - Quad Flat Packages - PLQP0048KB
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R5F51115AGFL#3A Details

  • Manufacturer Part Number:

    R5F51115AGFL#3A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LQFP

  • Package Description:

    LFQFP-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    PLQP0048KB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    8

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    RX

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of External Interrupts:

    8

  • Number of I/O Lines:

    32

  • Number of Serial I/Os:

    3

  • Number of Terminals:

    48

  • Number of Timers:

    8

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • RAM (bytes):

    16384

  • ROM (words):

    131072

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    24 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F51115AGFL#3A Frequently Asked Questions (FAQs)

  • Renesas recommends using a POR circuit with a 1 kΩ resistor, a 10 μF capacitor, and a diode (e.g., 1N4148) to ensure a clean power-on reset. This circuit helps to prevent latch-up and ensures that the device resets properly.
  • The R5F51115AGFL#3A has a flexible clock system that can be configured using the Clock Generator (CG) module. You can use the CG module to select the clock source, divide the clock frequency, and enable/disable the clock output. Refer to the datasheet and the Renesas clock configuration tool for more information.
  • The R5F51115AGFL#3A has an operating temperature range of -40°C to +85°C. However, it's essential to note that the device's performance and reliability may be affected at extreme temperatures. Always check the datasheet and application notes for specific temperature-related guidelines.
  • The R5F51115AGFL#3A has a built-in WDT that can be enabled and configured using the Watchdog Timer (WDT) module. You can set the WDT timeout period, enable/disable the WDT, and configure the WDT reset behavior using the WDT control registers. Refer to the datasheet and application notes for more information.
  • Renesas provides PCB layout guidelines for the R5F51115AGFL#3A in the datasheet and application notes. Key recommendations include keeping the power supply lines short and wide, using a solid ground plane, and minimizing signal trace lengths and vias. Additionally, ensure that the device's thermal pad is properly connected to a heat sink or thermal relief pattern.

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R5F51115AGFL#3A Overview

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