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R5F52104BDFM#30 - Renesas Electronics

Description: The RX210 Group has a wide operating voltage range of 1.62 V to 5.5 V and can execute calculations at 78 DMIPS (Dhrystone million instructions per second) at up to 50 MHz high-speed operation. Furthermore, it achieves 0.2 mA/MHz low power performance when operating at 50 MHz. Consumption current in deep software standby mode is a mere 0.45 µA. A wide lineup of 48 KB to 1 MB ROM and 48-pin to 145-pin products is available.

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R5F52104BDFM#30 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PLQP0064KB-A
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R5F52104BDFM#30 - Renesas Electronics  - 3D model - Quad Flat Packages - PLQP0064KB-A
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R5F52104BDFM#30 Details

  • Manufacturer Part Number:

    R5F52104BDFM#30

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    LQFP

  • Package Description:

    LQFP-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    PLQP0064KB

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    1

  • Has ADC:

    YES

  • Additional Feature:

    OPERATES 1.62 V MINIMUM SUPPLY AT 20 MHZ

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    RX210

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G64

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    4

  • Number of External Interrupts:

    7

  • Number of I/O Lines:

    48

  • Number of Serial I/Os:

    6

  • Number of Terminals:

    64

  • Number of Timers:

    10

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RAM (bytes):

    16384

  • ROM (words):

    98304

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    50 MHz

  • Supply Current-Max:

    55 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

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R5F52104BDFM#30 Overview

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