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R5F5630BCDFP#V0 - Renesas Electronics

Description: With flash memory capacities from small to large and package pin counts from low to high, the RX630 Group can satisfy the demands of a variety of embedded devices. All the products of the RX630 Group are equipped with E2 data flash capable of 100, 000 rewrites and enhanced peripheral functions with increased numbers of channels including timers, USB 2.0 function module, serial communication interface, I2C bus interface, CAN, 10-bit and 12-bit A/D converter, and 10-bit D/A converter. In particular, built-in

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R5F5630BCDFP#V0 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PLQP0100KB-A
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R5F5630BCDFP#V0 - Renesas Electronics  - 3D model - Quad Flat Packages - PLQP0100KB-A
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R5F5630BCDFP#V0 Details

  • Manufacturer Part Number:

    R5F5630BCDFP#V0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    LQFP

  • Package Description:

    14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    PLQP0100KB

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    3

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    RX630

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G100

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    4

  • Number of I/O Lines:

    79

  • Number of Terminals:

    100

  • Number of Timers:

    2

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    100 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

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R5F5630BCDFP#V0 Overview

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