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R5F5630BDDFB#V0 - Renesas Electronics

Description: With flash memory capacities from small to large and package pin counts from low to high, the RX630 Group can satisfy the demands of a variety of embedded devices. All the products of the RX630 Group are equipped with E2 data flash capable of 100, 000 rewrites and enhanced peripheral functions with increased numbers of channels including timers, USB 2.0 function module, serial communication interface, I2C bus interface, CAN, 10-bit and 12-bit A/D converter, and 10-bit D/A converter. In particular, built-in

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R5F5630BDDFB#V0 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - P-LQFP144-20x20-0.50_-
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R5F5630BDDFB#V0 Details

  • Manufacturer Part Number:

    R5F5630BDDFB#V0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    LQFP

  • Package Description:

    20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144

  • Pin Count:

    144

  • Manufacturer Package Code:

    PLQP0144KA

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    3

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    RX630

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G144

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    4

  • Number of I/O Lines:

    118

  • Number of Terminals:

    144

  • Number of Timers:

    2

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    98304

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    100 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F5630BDDFB#V0 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to first apply the power supply voltage (VCC) and then the clock signal (CLK). This ensures that the internal voltage regulators and clock circuits are properly initialized.
  • The clock settings can be configured through the Clock Control Register (CCR) and the PLL Control Register (PCR). Refer to the Renesas Electronics Corporation's documentation and application notes for specific details on clock configuration.
  • The maximum operating temperature range for the R5F5630BDDFB#V0 is -40°C to +125°C. However, it's recommended to operate the device within the industrial temperature range of -40°C to +85°C for optimal performance and reliability.
  • The R5F5630BDDFB#V0 has a built-in watchdog timer (WDT) that can be enabled and configured through the Watchdog Timer Control Register (WTCR). The WDT can be used to reset the device in case of a software or hardware failure.
  • Renesas recommends using 0.1uF to 1uF decoupling capacitors for the power supply pins (VCC) and 10nF to 100nF decoupling capacitors for the analog power supply pins (AVCC). The exact values may vary depending on the specific application and PCB design.

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