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R5F563TCDDFP#V0 - Renesas Electronics

Description: Like the RX62T Group, the high performance (max. 100 MHz) of this microcontroller makes it ideal for motor control. On-chip functions include multifunction timers (MTU3 and GPT) that facilitate motor control, a high-speed 12-bit A/D converter, and a 10-bit A/D converter.

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R5F563TCDDFP#V0 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PLQP0100KB-A
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R5F563TCDDFP#V0 - Renesas Electronics  - 3D model - Quad Flat Packages - PLQP0100KB-A
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R5F563TCDDFP#V0 Details

  • Manufacturer Part Number:

    R5F563TCDDFP#V0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    LQFP

  • Package Description:

    LQFP-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    PLQP0100KB

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    3

  • Has ADC:

    YES

  • Address Bus Width:

    20

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    RX63T

  • Clock Frequency-Max:

    14 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G100

  • Length:

    14 mm

  • Number of DMA Channels:

    4

  • Number of I/O Lines:

    78

  • Number of Terminals:

    100

  • Number of Timers:

    24

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RAM (bytes):

    32768

  • ROM (words):

    393216

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    100 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F563TCDDFP#V0 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the R5F563TCDDFP#V0 is -40°C to +85°C, as specified in the datasheet. However, it's essential to note that the device can operate at a wider temperature range, but with reduced performance and reliability.
  • To ensure reliable communication with the R5F563TCDDFP#V0's serial interfaces, such as UART, SPI, and I2C, it's crucial to follow the recommended signal integrity guidelines, including proper termination, signal routing, and clock synchronization. Additionally, ensure that the communication protocol and baud rate are correctly configured.
  • The maximum current consumption of the R5F563TCDDFP#V0 depends on the operating frequency, voltage, and peripheral usage. According to the datasheet, the maximum current consumption is approximately 350 mA at 3.3V and 100 MHz. However, this value can vary depending on the specific application and usage scenario.
  • To optimize power consumption, use the R5F563TCDDFP#V0's power management features, such as dynamic voltage and frequency scaling, clock gating, and peripheral power control. Additionally, consider using low-power modes, such as sleep or standby, when the device is not actively processing data. Properly configure the power management registers and use the device's power-saving features to minimize power consumption.
  • When designing a PCB with the R5F563TCDDFP#V0, ensure proper signal routing, decoupling, and grounding. Follow the recommended PCB layout guidelines, including keeping sensitive analog signals away from digital signals, using proper power and ground planes, and minimizing signal trace lengths. Additionally, consider using a 4-layer or 6-layer PCB to reduce noise and improve signal integrity.

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R5F563TCDDFP#V0 Overview

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