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R5F5671EHGFP#30 - Renesas Electronics

Description: The RX671 group microcontrollers deliver superior real-time performance with the RXv3 core running at 120MHz. The HMI functions enable contactless operation by proximity switches and voice recognition, making it possible to realize hygienic HMI suitable for the new normal. A wide variety of packages, including the 4.5mm x 4.5mm 64-pin TFBGA, is all equipped with 2MB flash memory and 384KB SRAM to meet a wide range of needs with a single chip.

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R5F5671EHGFP#30 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PLQP0100KB-B
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R5F5671EHGFP#30 - Renesas Electronics  - 3D model - Quad Flat Packages - PLQP0100KB-B
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R5F5671EHGFP#30 Details

  • Manufacturer Part Number:

    R5F5671EHGFP#30

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LFQFP

  • Package Description:

    LFQFP-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    PLQP0100KB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    13

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    RX671

  • Clock Frequency-Max:

    30 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G100

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    10

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    81

  • Number of Serial I/Os:

    15

  • Number of Terminals:

    100

  • Number of Timers:

    25

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Packing Method:

    TRAY

  • RAM (bytes):

    393216

  • ROM (words):

    2097152

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    120 MHz

  • Supply Current-Max:

    68 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F5671EHGFP#30 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply VCC first, followed by VCCPLL, and then the clock signal. This ensures proper initialization of the internal PLL and clock circuits.
  • The clock settings can be configured using the Clock Control Register (CKCR) and the PLL Control Register (PLLCR). Refer to the user manual for detailed information on clock configuration and settings.
  • The maximum operating frequency of the R5F5671EHGFP#30 is 240 MHz, but it can be adjusted using the clock control registers to optimize power consumption and performance.
  • The built-in flash memory can be accessed using the Flash Memory Interface (FMI) and the Flash Control Register (FCR). Refer to the user manual for detailed information on flash memory programming and erasing.
  • The ADC has a maximum sampling rate of 1.5 MSPS and a resolution of 12 bits. It also has a limited input voltage range of 0 to VCC, and the input impedance is around 10 kΩ.

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R5F5671EHGFP#30 Overview

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