Description:The H8SX/1658R, H8SX/1658M Group is supported only for customers who have already adopted these products. The RX651 Group is recommended for new designs.
14 X 14 MM, 0.40 MM PITCH, LEAD FREE, PLASTIC, LQFP-120
Pin Count:
120
Manufacturer Package Code:
PLQP0120LA
ECCN Code:
3A991.a.2
HTS Code:
8542.31.00.25
Factory Lead Time:
12 Weeks
Manufacturer:
Renesas Electronics Corporation
YTEOL:
5
Has ADC:
YES
Address Bus Width:
21
Bit Size:
32
Boundary Scan:
YES
CPU Family:
H8SX
Clock Frequency-Max:
50 MHz
DAC Channels:
YES
DMA Channels:
YES
External Data Bus Width:
16
JESD-30 Code:
S-PQFP-G120
Length:
14 mm
Number of I/O Lines:
84
Number of Terminals:
120
On Chip Program ROM Width:
8
Operating Temperature-Max:
75 °C
Operating Temperature-Min:
-20 °C
PWM Channels:
YES
Package Body Material:
PLASTIC/EPOXY
Package Code:
LFQFP
Package Equivalence Code:
QFP120,.63SQ,16
Package Shape:
SQUARE
Package Style:
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Qualification Status:
Not Qualified
RAM (bytes):
57344
ROM (words):
1048576
ROM Programmability:
FLASH
Seated Height-Max:
1.7 mm
Speed:
50 MHz
Supply Current-Max:
85 mA
Supply Voltage-Max:
3.6 V
Supply Voltage-Min:
3.3 V
Supply Voltage-Nom:
3.3 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
COMMERCIAL EXTENDED
Terminal Form:
GULL WING
Terminal Pitch:
0.4 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Width:
14 mm
uPs/uCs/Peripheral ICs Type:
MICROCONTROLLER
R5F61658RN50FPV Frequently Asked Questions (FAQs)
Renesas provides a reference design guide for PCB layout, which includes recommendations for component placement, and thermal management. It's essential to follow these guidelines to ensure optimal performance and minimize electromagnetic interference (EMI).
The R5F61658RN50FPV has multiple low-power modes, including Sleep, Stop, and Hibernate. To configure the device for low-power modes, refer to the datasheet and the device's software development kit (SDK) documentation, which provides examples and APIs for power management.
The R5F61658RN50FPV thermal management is critical to ensure reliable operation. The datasheet provides thermal resistance values, and Renesas recommends using thermal vias, heat spreaders, and thermal interface materials to maintain a safe operating temperature range.
Renesas provides a secure boot mechanism and firmware update protocols. Implementing secure boot and firmware updates requires a deep understanding of the device's architecture, cryptographic algorithms, and secure communication protocols. Renesas recommends consulting the device's security documentation and seeking guidance from experienced security experts.
Renesas provides EMC and EMI guidelines in the datasheet and recommends following industry standards, such as IEC 61000-4-2, for electromagnetic compatibility. It's essential to design the PCB and system with EMC and EMI considerations to ensure reliable operation and compliance with regulatory requirements.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
R5F61658RN50FPV Overview
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