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R6024KNX - ROHM Semiconductor

Description: 600V 24A TO-220FM, High-speed switching Power MOSFET

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PCB Footprints
R6024KNX - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220FM-1
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3D Models
R6024KNX - ROHM Semiconductor  - 3D model - Transistor Outline, Vertical - TO-220FM-1
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R6024KNX Details

  • Manufacturer Part Number:

    R6024KNX

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-220FM, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    497 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    24 A

  • Drain-source On Resistance-Max:

    0.165 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    72 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

R6024KNX Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • The R6024KNX requires a stable input voltage (VIN) and a bias voltage (VCC) to operate correctly. Ensure that VIN is within the recommended range (2.5V to 5.5V) and VCC is set to 1.2V to 1.8V. Additionally, decouple VIN and VCC with suitable capacitors to reduce noise and ripple.
  • The maximum power dissipation for the R6024KNX is 1.5W. However, this value can be derated based on the ambient temperature and the thermal resistance of the PCB. ROHM provides a thermal derating curve in the datasheet to help designers estimate the maximum power dissipation for their specific application.
  • The R6024KNX is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. ROHM recommends derating the power dissipation and ensuring proper thermal management to maintain the device's performance and lifespan in high-temperature environments.
  • To troubleshoot issues with the R6024KNX, start by verifying the input voltage, bias voltage, and output voltage. Check for any signs of overheating, such as excessive temperature or thermal shutdown. Use an oscilloscope to monitor the output voltage and current, and consult the datasheet for guidance on troubleshooting specific issues.

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R6024KNX Overview

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