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R6030KNX - ROHM Semiconductor

Description: MOSFET Nch 600V 30A Si MOSFET

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PCB Footprints
R6030KNX - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220FM4
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3D Models
R6030KNX - ROHM Semiconductor  - 3D model - Transistor Outline, Vertical - TO-220FM4
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R6030KNX Details

  • Manufacturer Part Number:

    R6030KNX

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-220FM, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    636 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    30 A

  • Drain-source On Resistance-Max:

    0.13 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    80 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

R6030KNX Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
  • The R6030KNX requires a stable input voltage (VIN) and a proper bias voltage (VBIAS) to operate correctly. Ensure VIN is within the recommended range (2.5V to 5.5V) and VBIAS is set to 1.2V ± 0.1V. Additionally, decouple VIN and VBIAS with suitable capacitors to minimize noise and ripple.
  • The maximum power dissipation (PD) for the R6030KNX is 1.5W. However, this value can be derated based on the ambient temperature (TA) and the thermal resistance (RthJA) of the package. Consult the datasheet for the derating curve to ensure safe operation.
  • The R6030KNX is rated for operation up to 125°C (TJ). However, the device's performance and reliability may degrade at high temperatures. Ensure proper heat sinking and thermal management to maintain a safe junction temperature (TJ) below 125°C.
  • To troubleshoot issues with the R6030KNX, start by verifying the input voltage (VIN) and bias voltage (VBIAS) are within the recommended ranges. Check for proper PCB layout, thermal management, and decoupling. Use an oscilloscope to monitor the output voltage and current. Consult the datasheet and application notes for guidance on troubleshooting and fault detection.

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R6030KNX Overview

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