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R7F701215EABG - Renesas Electronics

Description: RH850/E1M-S2 are suitable for engine control, and at 320 MHz have the highest class of operating frequency among automotive microcontrollers. The CPU core of the RH850/E1M-S2 delivers 30% better performance for engine control system applications than its predecessor. The RH850/E1M-S2 supports the SENT communication standard for sensor information, and also supports not only CAN FD for higher speed in-vehicle networks, but also ICU-S for the automotive security that will be demanded by cars going forward. It

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R7F701215EABG - Renesas Electronics PCB footprint - BGA - BGA - PRBG0252GB-A
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R7F701215EABG - Renesas Electronics  - 3D model - BGA - PRBG0252GB-A
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R7F701215EABG Details

  • Manufacturer Part Number:

    R7F701215EABG

  • Brand Name:

    Renesas

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA252

  • Package Description:

    BGA-252

  • Pin Count:

    252

  • Manufacturer Package Code:

    PRBG0252GB-A

  • ECCN Code:

    3A001.a.2.a

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7.99

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    RH850

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B252

  • Length:

    17 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    8

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    252

  • Number of Timers:

    140

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA252,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • RAM (bytes):

    360448

  • ROM (words):

    4194304

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    2 mm

  • Speed:

    240 MHz

  • Supply Current-Max:

    500 mA

  • Supply Voltage-Max:

    1.35 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.25 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

Trust Checks

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Manufacturer Collaborated
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R7F701215EABG Overview

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