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R7F7016863AFP-C - Renesas Electronics

Description: The RH850/F1KM-S1 is one group of single-chip microcontrollers in the RH850/F1x series which is designed for automotive electrical body applications. While it achieves low power consumption, the internal flash memory ranges from 512KB to 1MB and the package covers a wide range from 48 to 100 pins. Also, a CAN FD interface has been added and the CPU operating frequency operates up to 120MHz.

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R7F7016863AFP-C - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PLQP0100KB-A
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R7F7016863AFP-C - Renesas Electronics  - 3D model - Quad Flat Packages - PLQP0100KB-A
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R7F7016863AFP-C Details

  • Manufacturer Part Number:

    R7F7016863AFP-C

  • Brand Name:

    Renesas

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP100

  • Pin Count:

    100

  • Manufacturer Package Code:

    PLQP0100KB-A

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    8

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    RH850

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G100

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    14

  • Number of I/O Lines:

    81

  • Number of Serial I/Os:

    13

  • Number of Terminals:

    100

  • Number of Timers:

    50

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • RAM (bytes):

    32768

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    120 MHz

  • Supply Current-Max:

    82 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

R7F7016863AFP-C Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, thermal management, and to minimize electromagnetic interference (EMI).
  • Renesas provides a Secure Firmware Update (SFU) solution that enables secure boot and firmware updates. Engineers can use the Renesas Flash Programmer tool and follow the guidelines in the SFU application note to implement secure firmware updates.
  • While the datasheet provides some power consumption and thermal characteristics, engineers may need more detailed information. Renesas provides power consumption and thermal characteristic data in their application notes and design guides. Additionally, engineers can use tools like the Renesas Power Calculator to estimate power consumption.
  • Renesas provides optimization guidelines and tips in their application notes and design guides. Engineers can also use the Renesas Compiler Package (CC-RX) and the IAR Embedded Workbench to optimize the performance of the Arm Cortex-M4 core and peripherals.
  • Renesas provides a range of development tools, including the Renesas Starter Kit, the Renesas Compiler Package (CC-RX), and the IAR Embedded Workbench. Additionally, Renesas offers various SDKs, such as the Renesas Synergy Software Package, that provide a comprehensive set of software components and tools for developing applications.

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R7F7016863AFP-C Overview

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