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R7FA2E2A52DNK#BA1 - Renesas Electronics

Description: The RA2E2 Group is RA Family’s entry line single-chip microcontroller based on the 48-MHz Arm® Cortex®-M23 core with Renesas' innovative on-chip peripheral functions. RA2E2 Group offers ultra-low power operation and high speed serial communication with smallest package options of 20-pin and 24-pin QFN and 16-pin wafer-level CSP package, satisfying the needs of cost-sensitive and space-constrained applications. These RA2E2 Group microcontrollers enable extremely cost-effective designs for IoT sensor nodes, p

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R7FA2E2A52DNK#BA1 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - Pwqn0024kg-a
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R7FA2E2A52DNK#BA1 - Renesas Electronics  - 3D model - Quad Flat No-Lead - Pwqn0024kg-a
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R7FA2E2A52DNK#BA1 Details

  • Manufacturer Part Number:

    R7FA2E2A52DNK#BA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HWQFN-24

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    11

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    CORTEX-M23

  • Clock Frequency-Max:

    64 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-XQCC-N24

  • Length:

    4 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of External Interrupts:

    8

  • Number of I/O Lines:

    20

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    24

  • Number of Timers:

    9

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • RAM (bytes):

    8192

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.8 mm

  • Speed:

    48 MHz

  • Supply Current-Max:

    10.5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

Trust Checks

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Manufacturer Collaborated
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System Verified
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Community Approved
Sponsored

R7FA2E2A52DNK#BA1 Overview

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