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R7FA4M2AB3CFP#AA0 - Renesas Electronics

Description: The Renesas RA4M2 group of 32-bit microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M33 core with TrustZone. In concert with the secure crypto engine, it offers secure element functionality. The RA4M2 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M2 is suitable for IoT applications requiring vast communication options, futur

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R7FA4M2AB3CFP#AA0 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PLQP0100KB-B
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R7FA4M2AB3CFP#AA0 Details

  • Manufacturer Part Number:

    R7FA4M2AB3CFP#AA0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PLQP0100KB

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    14

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M33

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    8

  • Number of I/O Lines:

    78

  • Number of Serial I/Os:

    8

  • Number of Terminals:

    100

  • Number of Timers:

    15

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • RAM (bytes):

    131072

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    100 MHz

  • Supply Current-Max:

    65 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

R7FA4M2AB3CFP#AA0 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply the power supply voltage (VCC) first, followed by the clock signal (XIN). This ensures proper initialization of the internal voltage regulator and clock circuitry.
  • To optimize power consumption in low-power modes, use the built-in low-power modes (e.g., SLEEP, STOP, and HALT) and adjust the clock frequency, disable unnecessary peripherals, and use the internal voltage regulator's low-power mode.
  • The maximum allowed capacitance for the XIN pin is 20 pF. Exceeding this value may affect the oscillator's stability and startup time.
  • Yes, the R7FA4M2AB3CFP#AA0 is rated for operation up to 125°C. However, ensure proper thermal design and heat dissipation to prevent overheating and reduce the risk of device failure.
  • Implement secure boot mechanisms by using the built-in cryptographic accelerators, secure boot ROM, and configuring the boot mode to use the internal flash memory. Additionally, use secure key storage and encryption to protect the boot code and firmware.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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System Verified
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Sponsored

R7FA4M2AB3CFP#AA0 Overview

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