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R7FA6M5BH2CBG#AC0 - Renesas Electronics

Description: The Renesas RA6M5 group uses the high-performance Arm® Cortex®-M33 core with TrustZone®. In concert with the Secure Crypto Engine it offers Secure Element functionality. The integrated Ethernet MAC with individual DMA ensures high data throughput. The RA6M5 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA6M5 is suitable for IoT applications

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R7FA6M5BH2CBG#AC0 - Renesas Electronics PCB footprint - BGA - BGA - R7FA6M5BH2CBG#AC0
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R7FA6M5BH2CBG#AC0 Details

  • Manufacturer Part Number:

    R7FA6M5BH2CBG#AC0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    176

  • Manufacturer Package Code:

    PLBG0176GE

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    8

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    RA6M5

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B176

  • Length:

    13 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    8

  • Number of I/O Lines:

    133

  • Number of Serial I/Os:

    13

  • Number of Terminals:

    176

  • Number of Timers:

    17

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA176,15X15,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Packing Method:

    TRAY

  • RAM (bytes):

    524288

  • ROM (words):

    2097152

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.4 mm

  • Speed:

    200 MHz

  • Supply Current-Max:

    143 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

R7FA6M5BH2CBG#AC0 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the R7FA6M5BH2CBG#AC0 is -40°C to +85°C.
  • The clock settings for the R7FA6M5BH2CBG#AC0 can be configured using the Clock Control Register (CCR) and the System Clock Control Register (SCCR). Refer to the datasheet and the Renesas Synergy Platform documentation for detailed instructions.
  • The maximum frequency of the R7FA6M5BH2CBG#AC0's CPU is 240 MHz.
  • The R7FA6M5BH2CBG#AC0 has 2 MB of flash memory.
  • Yes, the R7FA6M5BH2CBG#AC0 can be used with an external crystal oscillator. The device has an internal oscillator, but an external crystal oscillator can be used for more accurate clocking.

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R7FA6M5BH2CBG#AC0 Overview

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