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R7FA8E2AFDCBD#UC0 - Renesas Electronics

Description: The Renesas RA8E2 MCU group features entry-line graphics-enabled 32-bit microcontrollers (MCUs) based on the Arm® Cortex®-M85 (CM85) core with Helium and TrustZone®, delivering breakthrough performance of over 3000 CoreMark points at 480 MHz, and graphics capabilities that drive TFT-LCD displays. These MCUs address diverse high-performance graphics applications in industrial automation, home appliances, smart home, consumer, building/home automation, and medical/healthcare market segments.The RA8E2 MCUs int

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R7FA8E2AFDCBD#UC0 - Renesas Electronics PCB footprint - BGA - BGA - PLBG0224GD-A
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R7FA8E2AFDCBD#UC0 - Renesas Electronics  - 3D model - BGA - PLBG0224GD-A
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R7FA8E2AFDCBD#UC0 Details

  • Manufacturer Part Number:

    R7FA8E2AFDCBD#UC0

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-224

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    10

  • Has ADC:

    YES

  • Address Bus Width:

    17

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M85

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B224

  • Length:

    13 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    8

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    174

  • Number of Serial I/Os:

    10

  • Number of Terminals:

    224

  • Number of Timers:

    16

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA224,15X15,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Packing Method:

    TRAY

  • RAM (bytes):

    688128

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.47 mm

  • Speed:

    480 MHz

  • Supply Current-Max:

    624 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.68 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

R7FA8E2AFDCBD#UC0 Overview

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