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R7FS3A17C2A01CBJ#AC0 - Renesas Electronics

Description: Ideal for monitoring applications that may require ongoing feature upgrades for multiple services, the S3A1 MCU Group offers ample room for expansion and the optimal combination of low power and high performance, with an Arm® Cortex®-M4 CPU core running up to 48 MHz, 1 MB of flash memory, and 192 KB of SRAM. It includes an additional 12-bit D/A Converter as well as multiple 32-Bit General PWM timers and serial communications interfaces.Synergy Software Package (SSP)Commercial software worth over $100K which

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R7FS3A17C2A01CBJ#AC0 - Renesas Electronics PCB footprint - BGA - BGA - PLBG0121JA-A-5
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R7FS3A17C2A01CBJ#AC0 - Renesas Electronics  - 3D model - BGA - PLBG0121JA-A-5
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R7FS3A17C2A01CBJ#AC0 Details

  • Manufacturer Part Number:

    R7FS3A17C2A01CBJ#AC0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Pin Count:

    121

  • Manufacturer Package Code:

    PLBG0121JA

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2018-02-27

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Address Bus Width:

    22

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    15

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B121

  • Length:

    8 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    4

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    104

  • Number of Serial I/Os:

    8

  • Number of Terminals:

    121

  • Number of Timers:

    13

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA121,11X11,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • RAM (bytes):

    196608

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.31 mm

  • Speed:

    48 MHz

  • Supply Current-Max:

    62 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

R7FS3A17C2A01CBJ#AC0 Overview

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