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R7FS5D37A3A01CNB#BA0 - Renesas Electronics

Description: The S5D3 adds a new tier to the S5 MCU series for applications that require a high-performance Cortex M4F core at a very attractive price point, that does not require on-chip graphic acceleration or Ethernet connectivity. The S5D3 is built on a highly efficient 40nm process, offers enhanced security, wide connectivity and is fully supported by the Synergy Software Package (SSP).Synergy Software Package (SSP)Commercial software worth over $100K which is available to developers using the Synergy Platform for

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R7FS5D37A3A01CNB#BA0 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN
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R7FS5D37A3A01CNB#BA0 - Renesas Electronics  - 3D model - Quad Flat No-Lead - QFN
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R7FS5D37A3A01CNB#BA0 Details

  • Manufacturer Part Number:

    R7FS5D37A3A01CNB#BA0

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-64

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    8

  • Has ADC:

    YES

  • Address Bus Width:

    13

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    8

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-XQCC-N64

  • Length:

    8 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    8

  • Number of I/O Lines:

    40

  • Number of Serial I/Os:

    7

  • Number of Terminals:

    64

  • Number of Timers:

    13

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.32SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • RAM (bytes):

    262144

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.8 mm

  • Speed:

    120 MHz

  • Supply Current-Max:

    87 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    8 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

Trust Checks

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Manufacturer Collaborated
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System Verified
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Sponsored

R7FS5D37A3A01CNB#BA0 Overview

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