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R8007AND3FRATL - ROHM Semiconductor

Description: N-Channel 800V 7A (Tc) 140W (Tc) Surface Mount TO-252

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R8007AND3FRATL - ROHM Semiconductor - PCB symbol
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PCB Footprints
R8007AND3FRATL - ROHM Semiconductor PCB footprint - Other - Other - TO-252 (DPAK)_Master
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R8007AND3FRATL - ROHM Semiconductor - 3D model - Other - TO-252 (DPAK)_Master
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R8007AND3FRATL Details

  • Manufacturer Part Number:

    R8007AND3FRATL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Date Of Intro:

    2020-03-23

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    3.25 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    800 V

  • Drain Current-Max (ID):

    7 A

  • Drain-source On Resistance-Max:

    1.6 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    20 pF

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    140 W

  • Pulsed Drain Current-Max (IDM):

    21 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

R8007AND3FRATL Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure stable output voltage regulation, it's essential to follow the recommended input and output capacitor values, as well as the suggested PCB layout. Additionally, ensure that the input voltage is within the recommended range, and the output current is within the specified maximum rating.
  • The maximum junction temperature (Tj) for the R8007AND3FRATL is 125°C. Operating the device above this temperature can lead to reduced reliability and lifespan.
  • While the device can operate up to 125°C, it's essential to consider the derating curves and thermal management to ensure reliable operation in high-temperature environments. Consult ROHM's application notes and thermal design guidelines for more information.
  • The POR pin should be connected to a capacitor to ensure a clean power-on reset. The EN pin should be connected to a logic signal or a pull-up resistor to enable or disable the device. Consult the datasheet for specific guidelines and timing diagrams.

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R8007AND3FRATL Overview

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