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RAA230233GSB#HA0 - Renesas Electronics

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RAA230233GSB#HA0 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PTSP0020JF-A
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RAA230233GSB#HA0 - Renesas Electronics  - 3D model - Small Outline Packages - PTSP0020JF-A
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RAA230233GSB#HA0 Details

  • Manufacturer Part Number:

    RAA230233GSB#HA0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    HTSSOP

  • Package Description:

    HTSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    PTSP0020JF

  • ECCN Code:

    5A002

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    0.8V TO 6V ADDITIONAL ADJUSTABLE OUTPUT IS AVAILABLE

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Input Voltage-Max:

    16 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Max:

    6 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP20,.25,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Protections:

    SHORT CIRCUIT, THERMAL, UNDER VOLTAGE

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Total Power Output-Max:

    18 W

  • Trim/Adjustable Output:

    YES

  • Width:

    4.4 mm

RAA230233GSB#HA0 Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide for the RAA230233GSB#HA0, which includes recommended PCB layout and thermal management guidelines. It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and electromagnetic compatibility.
  • The RAA230233GSB#HA0 has built-in overcurrent protection and fault detection features. However, to implement these features, you'll need to use external components and programming. Renesas provides application notes and code examples to help you implement these features.
  • The recommended settings for the internal regulators can be found in the device's datasheet and application notes. However, the optimal settings may vary depending on your specific application and board design. It's recommended to consult with Renesas support or a qualified engineer for customized guidance.
  • To ensure EMC and reduce EMI, follow the recommended PCB layout and design guidelines provided by Renesas. Additionally, use proper shielding, filtering, and grounding techniques. It's also essential to perform EMC testing and certification to ensure compliance with relevant standards.
  • The thermal limitations and derating factors for the RAA230233GSB#HA0 can be found in the device's datasheet. However, it's essential to consider the specific application, PCB design, and environmental conditions to determine the actual thermal performance. Consult with Renesas support or a qualified engineer for customized guidance.

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RAA230233GSB#HA0 Overview

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