RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
Yes, the RAC01-12SGA is designed to withstand vibrations up to 10G peak acceleration, making it suitable for use in industrial and transportation applications. However, it's recommended to follow proper mounting and screwing procedures to ensure the module is securely fastened to the PCB or chassis.
To ensure reliability in high-temperature environments, it's essential to follow the recommended derating curves for output power and ambient temperature. Additionally, ensure good airflow around the module, and consider using a heat sink or thermal interface material to reduce the thermal resistance between the module and the PCB or chassis.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22uF, X7R or X5R dielectric, and a voltage rating of 50V or higher. The capacitor should be placed as close as possible to the module's input pins to minimize noise and ripple.
Yes, the RAC01-12SGA can be used in a redundant or parallel configuration to achieve higher output power or redundancy. However, it's essential to follow proper design guidelines and ensure that the modules are synchronized and properly connected to avoid any potential issues.
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