RAC01-3.3SC - RECOM Power

RAC01-3.3SC Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be connected to a solid ground plane to reduce thermal resistance.
• Can I use this module in a high-vibration environment?
  Yes, the RAC01-3.3SC is designed to withstand vibrations up to 10G peak acceleration, making it suitable for use in industrial and transportation applications. However, it's essential to ensure proper mounting and screw torque to prevent damage.
• How do I ensure the module's reliability in high-temperature environments?
  To ensure reliability, RECOM recommends derating the module's output power by 2.5% per degree Celsius above 40°C. Additionally, ensure good airflow around the module, and consider using a heat sink or thermal interface material to reduce the junction temperature.
• What is the recommended input capacitor value and type for this module?
  RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF, rated for the input voltage range, to filter the input voltage and reduce ripple. X5R or X7R dielectric types are suitable for this application.
• Can I parallel multiple RAC01-3.3SC modules to increase the output current?
  Yes, you can parallel multiple modules to increase the output current. However, it's essential to ensure that the modules are identical, and the output voltages are matched within 1% to prevent current imbalance. Additionally, a common input capacitor and output capacitor should be used to minimize voltage differences between the modules.