RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
Yes, the RAC02-24SGA is designed to withstand vibrations up to 10G peak acceleration, making it suitable for use in high-vibration environments. However, it's recommended to ensure that the module is properly secured to the PCB and that the PCB is designed to withstand the vibrations.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, rated for the input voltage range, as close as possible to the input pins of the module. This helps to reduce input ripple and ensure stable operation.
The RAC02-24SGA has a conformal coating that provides some protection against humidity and moisture. However, it's not designed for use in wet or submerged environments. If you need to use the module in a humid environment, ensure that it's properly sealed and protected from moisture ingress.
According to RECOM, the MTBF of the RAC02-24SGA is approximately 2.5 million hours, calculated according to MIL-HDBK-217F at 40°C ambient temperature and 50% load.
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RAC02-24SGA Overview
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