RAC03-24SK/SMT-R - RECOM Power

RAC03-24SK/SMT-R Frequently Asked Questions (FAQs)

• What is the recommended PCB layout and thermal management for optimal performance?
  RECOM Power Inc recommends a PCB layout with a large copper area for heat dissipation, and a thermal via array under the module to improve heat transfer. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of at least 1W/mK should be used between the module and the heat sink.
• How do I ensure the module is properly soldered and avoid damage during the reflow process?
  RECOM Power Inc recommends following the recommended soldering profile, with a peak temperature of 260°C and a dwell time of 30-60 seconds. The module should be placed on a flat, even surface during reflow, and excessive vibration or movement should be avoided. Additionally, a soldering iron with a temperature-controlled tip should be used for manual soldering.
• What is the maximum allowable capacitance for the input and output capacitors?
  RECOM Power Inc recommends using input capacitors with a maximum capacitance of 47µF and output capacitors with a maximum capacitance of 100µF. Exceeding these values may affect the module's stability and performance.
• Can I use this module in a high-vibration or high-shock environment?
  The RAC03-24SK/SMT-R is designed to meet the requirements of IEC 60068-2-6 (vibration) and IEC 60068-2-27 (shock). However, it's recommended to perform additional testing and validation to ensure the module meets the specific requirements of your application.
• What is the recommended input fuse rating and type for this module?
  RECOM Power Inc recommends using a fuse with a rating of 1A to 2A, depending on the input voltage and current requirements of your application. A slow-blow fuse type is recommended to ensure reliable operation and minimize false tripping.