RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be connected to a solid ground plane to reduce thermal resistance.
Yes, the RAC03-3.3SGA is designed to withstand vibrations up to 10G peak acceleration, making it suitable for use in industrial and transportation applications. However, it's essential to ensure proper mounting and screw torque to prevent damage.
To ensure reliability, RECOM recommends derating the module's output power by 2.5% per degree Celsius above 40°C. Additionally, ensure good airflow around the module, and consider using a heat sink or thermal interface material to reduce the junction temperature.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF, rated for the input voltage range, as close to the module's input pins as possible. This helps to reduce input ripple and ensure stable operation.
Yes, the RAC03-3.3SGA can be used in redundant or parallel configurations to achieve higher output power or redundancy. However, it's essential to ensure proper synchronization and ORing diode implementation to prevent damage or instability.
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RAC03-3.3SGA Overview
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