The recommended PCB layout for optimal thermal performance is to have a large copper area on the bottom side of the PCB, connected to the module's thermal pad, and to use thermal vias to dissipate heat to the top side of the PCB.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the time the iron is in contact with the module's pins.
The recommended input capacitor value is 10uF to 22uF, and the recommended type is a low-ESR ceramic capacitor, such as X5R or X7R, with a voltage rating of at least 50V.
To protect the module from overvoltage and undervoltage conditions, use a voltage supervisor or a voltage monitor IC to monitor the input voltage and shut down the module if the voltage exceeds the recommended range.
The maximum allowed capacitance on the output of the module is 10uF. Exceeding this value may cause instability or oscillation in the module.
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RAC04-24SC/277-E Overview
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