RAC06-12DC - RECOM Power

RAC06-12DC Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be connected to a solid ground plane to reduce thermal resistance.
• Can I use the RAC06-12DC in a high-vibration environment?
  Yes, the RAC06-12DC is designed to withstand vibrations up to 10G peak acceleration, making it suitable for use in industrial and transportation applications. However, it's essential to ensure proper mounting and screw torque to prevent damage or disconnection.
• How do I ensure the module's reliability in high-temperature environments?
  To ensure reliability in high-temperature environments, it's crucial to maintain a safe operating temperature range (up to 85°C for the RAC06-12DC). This can be achieved by providing adequate airflow, using a heat sink, or reducing the output power to prevent overheating.
• What is the recommended input capacitor type and value for the RAC06-12DC?
  RECOM recommends using a low-ESR ceramic capacitor (X7R or X5R dielectric) with a value of 10-22 μF, 50V rating, and a voltage derating of 1.5 times the maximum input voltage to ensure stable operation and minimize input ripple.
• Can I parallel multiple RAC06-12DC modules to increase output power?
  Yes, it's possible to parallel multiple RAC06-12DC modules to increase output power. However, it's essential to ensure that the modules are identical, and the output voltages are matched to within 1% to prevent current imbalance and reduce the risk of damage.