RAC20-15DK/277 - RECOM Power

RAC20-15DK/277 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout and thermal management for optimal performance?
  RECOM Power Inc recommends a PCB layout with a large copper area for heat dissipation, and a thermal management system with a heat sink and thermal interface material to keep the junction temperature below 100°C.
• How do I ensure electromagnetic compatibility (EMC) with this module?
  To ensure EMC, RECOM Power Inc recommends following the layout and grounding guidelines in the datasheet, using a metal enclosure, and adding EMI filters and shielding as necessary.
• What is the derating curve for this module at high temperatures?
  The derating curve for the RAC20-15DK/277 is typically provided in the datasheet or can be obtained from RECOM Power Inc directly. It shows the reduction in output power as a function of temperature, typically starting at 50°C.
• Can I use this module in a redundant or parallel configuration?
  Yes, the RAC20-15DK/277 can be used in a redundant or parallel configuration, but it requires careful design and implementation to ensure proper operation and fault tolerance. Consult RECOM Power Inc for guidance on specific applications.
• What is the MTBF (Mean Time Between Failures) for this module?
  The MTBF for the RAC20-15DK/277 is typically provided in the datasheet or can be obtained from RECOM Power Inc directly. It is usually calculated according to MIL-HDBK-217F or IEC 61709 standards.