RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
Yes, the RACM100-12S/OF is designed to withstand high vibrations. It has been tested to meet the IEC 60068-2-6 standard for vibration resistance. However, it's recommended to consult with RECOM's application engineers to ensure the module meets the specific vibration requirements of your application.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22uF, X7R or X5R dielectric, and a voltage rating of 50V or higher. The capacitor should be placed as close as possible to the input pins of the module to minimize noise and ensure stable operation.
Yes, the RACM100-12S/OF can be used in a redundant or parallel configuration to achieve higher power or redundancy. However, it's recommended to consult with RECOM's application engineers to ensure the modules are properly configured and synchronized to avoid any potential issues.
The MTBF of the RACM100-12S/OF is calculated to be around 2.5 million hours, based on the Telcordia SR-332 standard. This is a theoretical value and may vary depending on the specific application and operating conditions.
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RACM100-12S/OF Overview
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